Technical proof
Verified multi-layer circuit assemblies operating across critical medical, industrial telemetry, and high-frequency communication environments.
Flagship execution
14-Layer high-speed compute
Low-noise medical sensor platform
Micro-watt sensor acquisition hardware with strict EMI shielding, low-dropout regulation, and sub-millimeter component placement for wearable diagnostic devices.
High-temp industrial telemetry controller
Ruggedized board design engineered for thermal cycles up to 125°C, featuring isolated CAN interfaces, redundant power rails, and DFM verification.
Industrial FPGA compute module
Custom 14-layer HDI architecture featuring 10Gbps+ differential pair routing, controlled impedance stackup, and real-time thermal management for edge processing.